2011年度植田研究室の研究発表論文

Scientific papers published by Ueda Laboratory in 2011 Fiscal

(1st April 2011〜 31st March 2012)



研究業績



@学術論文

1. Satoshi Ikezawa, Muneaki Wakamatsu, Yury L'vovich Zimin, Joanna Pawlat and Toshitsugu Ueda, "Development of Carbonaceous Particle Size Analyzer Using Laser-induced Incandescence Technology", IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp171-177 (5/2011)

2. Meng Zhao, Jiani Wang, Hiroshi Oigawa, Jing Ji, Hisanori Hayashi and Toshitsugu Ueda, "A Two-dimensional Anisotropic Wet Etching Simulator for Quartz Crystal", IEEJ Transactions on Sensors and Micromachines Vol.131, No.5, pp185-188 (5/2011)

3. S. Ikezawa, M. Wakamatsu, and T. Ueda, "Diesel Particulate Analysis Using SEM-EDX and Laser-induced Breakdown Spectroscopy", International Journal on Smart Sensing and Intelligent Systems Vol. 4, No. 2, pp174-188, June 2011

4. Xuefeng Li, Jinxing Liang, Hiroshi Oigawa, and Toshitsugu Ueda "Doubled Optical Path Length for Photonic Bandgap Fiber Gas Cell Using Micromirror", Japanese Journal of Applied Physics 50 (6/2011), 06GM01 1-4

5. Jinxing Liang, Xuefeng Li, Hongsheng Li, Yunfang Ni, Kunyu Li, Libin Huang, and Toshitsugu Ueda", Design and Fabrication of Quartz Micro-Electro-Mechanical System-Based Double-Ended Tuning Fork with Variable Sections", Japanese Journal of Applied Physics 50 (6/2011), 06GM06 1-4

6. Hongbin Shi, Faxing Che and Toshitsugu Ueda, "Experimental and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending", Microelectronics Reliability, Vol.51, No.9-11, pp. 1850-1855 (9/2011).

7. Hongbin Shi and Toshitsugu Ueda, "Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test", Microelectronics Reliability, Vol.51, No.9-11, pp. 1898-1902 (9/2011).

8. X. Li, J. Liang, Y. Zimin, Y. Zhang, S. Lin, and T. Ueda, "U-Band Wavelength References Based on Photonic Bandgap Fiber Technology", IEEE/OSA Journal of Lightwave Technology, Vol. 29, No. 19. pp. 2934-2939 (2011.9)

9. Zhang, Y., Minema, I., Zimin, L. G., Ueda, T., "Analysis of Radially Restored Images for Spherical Single Lens Cellphone Camera ", IEEE Sensors Journal, Volume: 11, Issue: 11, Pages: 2834 - 2844, Issue Date: Nov. 2011

10. X. Li, S. Lin, J. Liang, H. Oigawa, and T. Ueda, "Fiber-Optic Temperature Sensor Based on Difference of Thermal Expansion Coefficient between Fused Silica and Metallic Materials", IEEE Photonics Journal, Vol. 4, No. 1. pp. 155-162 (2012.1)

11. S. Ikezawa, M. Wakamatsu, and T. Ueda, "Development of Semi-Quantitative Analytical System for Metal Nanoparticle Ink using Laser-induced Breakdown Spectroscopy", International Journal on Smart Sensing and Intelligent Systems Vol. 5, No. 1, pp215-232, March 2012



A研究会・学会発表論文プロシーディングス

12. H.B.Shi, T.Ueda, "Effects of Edge and Corner bond Adhesives on Board-level Shear Strength of Lead-free Package-on-Package Devices", Proc. of 2011 International Conference on Electronics Packaging, pp. 83-88, April 13-15, Nara, Japan, (4/2011)

13. Y. Zimin, T. Ueda,"On-Wafer-Packaging of Crystal Quartz Based Devises Using Low-Temperature Anodic Bonding", Proc. of Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2011), pp. 148-151,May 11-13, 2011, Aix-en-Provence, France (5/2011)

14. M. Zhao, H. Oigawa, J. Wang, J. Ji, T. Ueda, "USE OF A NEW ANISOTROPIC ETCHING SIMULATOR ON QUARTZ CRYSTAL", Proc. of The 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS' 11), pp. 450-453, June 5-9, 2011, Beijing, China, (6/2011)

15. Hongbin Shi and Toshitsugu Ueda, "Thermal Cycling Reliability of Lead-free Package Stackable Very Thin Fine Pitch Ball Grid Array Assemblies with Reworkable Edge and Corner Bond Adhesives", Proc. of 2011 International Conference on Electronic Packaging Technology & High Density Packaging, pp. 81-86, August 8-11, Shanghai, China, (8/2011)

16. Hongbin Shi and Toshitsugu Ueda, "Investigation of Various Board-level Underfills and Adhesives for CTBGA Bend Performance Enhancements in Lead-free Portable Electronic Products", Proc. of 2011 International Conference on Electronic Packaging Technology & High Density Packaging, pp. 91-96, August 8-11, Shanghai, China, (8/2011)

17. Hongbin Shi and Toshitsugu Ueda, "Halogen-free and Reworkable Corner Bond Adhesive for Array-based Packages and the Impact on Board-level Solder Joint Reliability", Proc. of 2011 International Conference on Electronic Packaging Technology & High Density Packaging, pp. 108-113, August 8-11, Shanghai, China, (8/2011)

18. 池沢 聡, 若松 宗明, 植田 敏嗣, "アルゴンガス雰囲気におけるレーザー誘起ブレークダウン分光分析", レーザー学会第148回研究会報告,レーザー応用,pp.23-28, September 12, Kumamoto, Japan, (9/2011)

19. 斎藤達也, 津野 徹, 植田敏嗣, "LTCCコイルを用いた渦電流変位センサの開発", 第64回 電気関係学会九州支部連合大会講演論文集, pp.263, 佐賀大学, 2011年9月26日〜27日

20. 桐野 雄宇,大井川 寛,陳 欣匯,植田 敏嗣, "High-Q を実現するための新たな形状の水晶振動子の研究", 第64回 電気関係学会九州支部連合大会講演論文集, pp.264, 佐賀大学, 2011年9月26日〜27日

21. 銭 鋭,大井川 寛,山崎 大輔,植田 敏嗣, "MEMS 技術を利用したPlano-convex 形状水晶振動子の開発", 第64回 電気関係学会九州支部連合大会講演論文集, pp.265, 佐賀大学, 2011年9月26日〜27日

22. 程 サンサン,高森 政聡,植田 敏嗣, "MEMS 精密実装におけるフラックスレスリフローのプロセスの改善", 第64回 電気関係学会九州支部連合大会講演論文集, pp.266, 佐賀大学, 2011年9月26日〜27日

23. 劉 健男, 播磨 幸一, 高森 政聡, 植田 敏嗣, "2 軸静電容量型傾斜角センサの開発と評価", 第64回 電気関係学会九州支部連合大会講演論文集, pp.267, 佐賀大学, 2011年9月26日〜27日

24. 章磊, 津野徹, 植田敏嗣, "二軸傾斜センサシステムの開発-ステップ1", 第64回 電気関係学会九州支部連合大会講演論文集, pp.268, 佐賀大学, 2011年9月26日〜27日

25. 李 慧頴,張 宇鵬,吉居 慎二, 李 雪峰,植田 敏嗣, "イメージファイバーを用いた根管内観察システムの開発", 第64回 電気関係学会九州支部連合大会講演論文集, pp.269, 佐賀大学, 2011年9月26日〜27日

26. Yupeng Zhang, Ikumi Minema and Toshitsugu Ueda, "An ultra-thin imaging system for cell phone camera using spherical plano-convex single lens", Proceedings of the 28th SENSOR SYMPOSIUM on Sensors, Micromachines and Application Systems, pp.416-420, September 26-27, 2011, Tower Hall Funabori, Tokyo

27. Jing JI, Hiroshi OIGAWA, Hsin Hui CHEN, Meng ZHAO, and Toshitsugu UEDA, "Optimization of Electrodes Structure for High Frequency AT-cut Quartz Resonator Using FEM", Proceedings of the 28th SENSOR SYMPOSIUM on Sensors, Micromachines and Application Systems, pp.421-424, September 26-27, 2011, Tower Hall Funabori, Tokyo

28. J. JI, H. OHIGAWA, H. CHEN, M. ZHAO, T. UEDA, "Optimal Size Determination of Electrodes For High Frequency Fundamental AT-cut Quartz Resonator Using 3-D FEM", Proc. of 24th International Microprocesses and Nanotechnology Conference (MNC2011), pp(27P-11-138), October 24-27, 2011, ANA Hotel Kyoto, Kyoto, Japan

29. X. Li, S. Lin, J. Liang, H. Oigawa and T. Ueda, "High Sensitivity Fiber-optic Fabry-perot Interferometer Temperature Sensor", Proc. of 24th International Microprocesses and Nanotechnology Conference (MNC2011), pp(26P-7-127), October 24-27, 2011, ANA Hotel Kyoto, Kyoto, Japan

30. J. Liang, X. Li 2, H. Li 1 and T. Ueda, "Fabrication of Miniaturized High Frequency Quartz Crystal Microbalance using Wet Etching Process", Proc. of 24th International Microprocesses and Nanotechnology Conference (MNC2011), pp(27P-11-117), October 24-27, 2011, ANA Hotel Kyoto, Kyoto, Japan

31. H. Oigawa, Y. Kirino, H. Chen, J. Ji and T. Ueda, "Vibration Analysis of Original Shape Quartz Resonator for High Q Realization", Proc. of 24th International Microprocesses and Nanotechnology Conference (MNC2011), pp(27P-11-139), October 24-27, 2011, ANA Hotel Kyoto, Kyoto, Japan

32. X. Li, S. Lin,Y. Zimin, Y. Zhang, T. Ueda, "Alkanes Near-Infrared Spectrum Analysis Based on Hollow-core Photonic Bandgap Fiber", Proceedings of the IEEE Sensors2011, pp.250-253, October 28-31, 2011, University of Limerick, Limerick, Ireland

33. Yupeng Zhang, Toshitsugu Ueda, "Ultra-small imaging system for cell phone camera using birefringent lenses", Proceedings of the IEEE Sensors2011, pp.691-694, October 28-31, 2011, University of Limerick, Limerick, Ireland

34. Yury Zimin, Toshitsugu Ueda, "A reliability of silicon-crystalline quartz bonding through reducing of the residual stress", Proceedings of the IEEE Sensors2011, pp.951-953, October 28-31, 2011, University of Limerick, Limerick, Ireland

35. Satoshi Ikezawa, Muneaki Wakamatsu and Toshitsugu Ueda, "Sensing System for Quantitative Analysis of MetalParticles Using Laser-induced Breakdown Spectroscopy", Proceedings of the IEEE Sensors2011, pp.1596-1599, October 28-31, 2011, University of Limerick, Limerick, Ireland

36. Jing JI, Hiroshi OIGAWA, Hsin Hui CHEN, Meng ZHAO and Toshitsugu UEDA, "Size Optimization For High Frequency Quartz Resonator Using Finite Element Vibration Analysis", Proceedings of the IEEE Sensors2011, pp.1652-1655, October 28-31, 2011, University of Limerick, Limerick, Ireland

37. M. Zhao, H. Oigawa, J. Ji, T. Ueda, "Application of a 2-D Anisotropic Etching Simulator on Perforated Etching of Quartz Wafer", Proceedings of the IEEE Sensors2011, pp.1693-1696, October 28-31, 2011, University of Limerick, Limerick, Ireland

38. Hongbin Shi, Satoshi Ikezawa, and Toshitsugu Ueda, "A Novel Method for Evaluating Triaxial Strain Gages Used in Printed Circuit Board Assemblies (PCBA) Strain Monitoring", Proceedings of the IEEE Sensors2011, pp.1697-1700, October 28-31, 2011, University of Limerick, Limerick, Ireland

39. J. JI, H. OHIGAWA, M. ZHAO, H. YU, T. UEDA, "Electrode Optimization For High Frequency Fundamental Quartz Resonator Using FEM", 5th IPS International Collaboration Symposium, November 9-11, 2011, Waseda University, Kitakyushu, Fukuoka

40. Zimin Y., Ueda T., "Low-Temperature Anodic Bonding of Silicon and Quartz Crystal Wafers for MEMS Applications", 5th IPS International Collaboration Symposium, November 9-11, 2011, Waseda University, Kitakyushu, Fukuoka

41. Meng Zhao, Hiroshi Ohigawa, Jing Ji, Toshitsugu Ueda, "Application of a 2-D Anisotropic Etching Simulator on Z-plate Quartz Wafer", 5th IPS International Collaboration Symposium, November 9-11, 2011, Waseda University, Kitakyushu, Fukuoka

42. Satoshi Ikezawa, Muneaki Wakamatsu, Toshitsugu Ueda, "Quantitative Analysis of Silver Nanoparticle Ink using Laser-induced Breakdown Spectroscopy", Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 6-10, November 28 - December 1, 2011, Massey University, Palmerston North, New Zealand

43. Hiroshi Oigawa, Yu Kirino, Daisuke Yamazaki and Toshitsugu Ueda, "Quartz Resonator Hydrogen Sensor Using Platinum Black", Proceedings of the 2011 Fifth International Conference on Sensing Technology, pp. 587-590, November 28 - December 1, 2011, Massey University, Palmerston North, New Zealand

44. Hong-Bin Shi and Toshitsugu Ueda, "Mitigation of Thermal Fatigue Failure in Fully Underfilled Lead-free Array-based Package Assemblies Using Partial Underfills", Proceedings of the 13th Electronics Packaging Technology Conference, pp. 542-547, December 7-9, Singapore

45. Hong-Bin Shi and Toshitsugu Ueda, "Investigation on the Optimum Sampling Rate of Strain Measurement during Printed Circuit Board (PCB) System Assembly", Proceedings of the 13th Electronics Packaging Technology Conference, pp. 579-584, December 7-9, Singapore.

46. Hong-Bin Shi and Toshitsugu Ueda, "Effects of Reworkable Edge and Corner Bond Adhesives on the Thermal Fatigue Performance of Lead-Free Chip Scale Package Assemblies", Proceedings of 13th International Conference on Electronics Materials and Packaging, pp. EMAP2011FP-20 1-10, December 12-15, Kyoto, Japan.

47. 程サンサン, 高森政聡, 植田敏嗣 "MEMSパッケージの気密性評価法の開発", 平成24年電気学会全国大会, pp. , (3-131), 広島工業大学, 2012年3月21日〜3月23日

48. 劉健男, 播磨幸一, 高森政聡, 植田敏嗣, "二軸容量型傾斜角センサのプロセスの開発と評価", 平成24年電気学会全国大会, pp. , (3-121), 広島工業大学, 2012年3月21日〜3月23日

49. 羅 捷軍, 播磨幸一, 高森政聡, 幸坂扶佐夫, 植田敏嗣, "傾斜角センサの演算表示プログラム開発", 平成24年電気学会全国大会, pp. , (3-122), 広島工業大学, 2012年3月21日〜3月23日

50. 阪野祐也, 桐野雄宇, 大井川 寛, 植田敏嗣, "コンベックス振動子を模擬した新形状の高安定振動子", 平成24年電気学会全国大会, pp. , (3-124), 広島工業大学, 2012年3月21日〜3月23日


B展示会発表

51. 吉居慎二, 張宇鵬, 北村知昭, 西原達次, 植田敏嗣, "イメージファイバを用いた微細生体構造の診断ツールの開発", イノベーションジャパン2011